1. めっき加工・めっき関連技術開発のニシハラ理工
  2. Nishihara Rikoh, specializing in plating related manufacture and technology.
  3. Examples of solutions
  4. Solving problems with partial plating

Solving problems with partial plating

 

Issue ① Issues with terminals connecting batteries and printed circuit boards

 An increase in electronization in a wide variety of fields such as household appliances and automobile wheels is rapidly accelerating. However, it is necessary to ensure a power source by soldering a battery terminal onto the printed circuit board in areas which did not have electronic control functions before.

 Compact power sources are possible but the following problems occur with terminal connection.

  • The connection between the battery terminal and printed circuit board is weak, causing disconnection which disables the power source.
  • Soldering the printed circuit board and terminal requires preliminary solder plating. However, connecting the battery and terminal is done through welding so plating obstructs the welding.

Nishihara Rikoh Solutions

Nishihara Rikoh Solutions

 Tin plating of reel-to-reel only on areas of terminal soldering covers the area including the press fracture surface with tin film, therefore enables stronger soldering. Nickel plating on areas connected to batteries through welding ensures a high level of welding.

 Partial plating to stamped hoop materials was said to be difficult in the past. But now this has been realized through the development of our designated plating process.

Issue ② Optimal production of electronic components

 With electronic devices being used in a variety of different fields, the demand for electronic components is diversifying. Automation of production is increasing and parts are becoming more highly functional for electronic component manufacturers so the demands for plated materials composed of these electronic components are diversifying. It is necessary to overcome the following issues to optimize the production of electronic components.

  • When designing terminals, areas which require plating properties and areas which require base material properties exit within the same part.
  • When designing terminals, areas exit which become defective if plated.
  • When designing terminals, areas exit which become defective if plated.
  • Terminals which require properties of noble metals have high cost.

Nishihara Rikoh Solutions

めっき基材の一部分

 It is possible to apply partial hoop plating to only the necessary areas on the base materials. We offer proposals to reduce the amount of noble metals and combine the superior qualities of N-Sn and N-Ni plating with the qualities of base materials.

Partial plating

Plating on stamped hoop materials

  Finishing Undercoat Thickness[㎜] Width[㎜]
Base material Plating Max thickness[μm] Plating Max thickness[μm]
Cu (Pure copper,
Phosphor bronze,
Brass or other alloy)
Au 0.5 Ni 5 0.08~0.25 6~50
Sn 10 Ni 5 0.08~0.8 5~50
Sn-Bi 5 Ni 5 0.1~1.0 5~50
Stainless steel(SUS304) Sn 10 Ni 2.5 0.1~0.25 10~50

※Tolerance (SUS)

Liquid surface: Required dimensions ±1.0㎜ (Partial plating possible only with Sn plating)

Resistance: Required dimensions ±0.5㎜ (Partial plating possible only with Sn plating)

Plating on stamped hoop materials

Finishing plating Undercoat plating Tone Plating area
Bright Semi-Bright Matte Overall surface Stripe Partial
Tin Nickel or copper  
Tin-bismuth alloy Nickel        
Gold Nickel      
Silver Nickel + copper    
Nickel none    

 

Related Links

Continuous Plating

We provide hoop plating with stable quality at an inexpensive price.

N-Sn plating

N-Sn enables secure soldering and improves performance of electronic components.

High-functional Tin Plating

N-Sn enables secure soldering and improves performance of electronic components.

Plating on Aluminium

Our mass production technology and quality assurance process enable hoop plating on aluminum materials.

CONTACT

 

-Contact us by phone-

04-2934-6116

Weekdays from 9: 00 to 17: 30