Company Profile
Company Profile
| Company name | NISHIHARA RIKOH CORPORATION | |
| Foundation | August 20, 1951 | |
| Capital | 76,200,000 JPY | |
| Directors | President and Representive Director | Keiichi Nishihara |
| Director | Kouichi Nakashima | |
| Director | Hidehiro Okamura | |
| Auditor | Yoichi Sugimura | |
| No. of employees | approx. 180 | |
| Bank References | Resona Bank Kodaira branch MUFG Bank Mitaka Branch The Shoko Chukin Bank Hachioji Branch Japan Finance Corporation Tachikawa Branch The Tama Shinkin Bank Zambori Branch |
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Offices & Production Base
Head Office and Musashimurayama Factory
Head Office and General Affairs Department（Administrative Department）
2-1-1, Inadaira, Musashimurayama-shi, Tokyo, 208-0023 Japan MAP
TEL: ＋81(42)560-4011 FAX:＋81(42)560-4044
Musashimurayama Factory
2-1-1, Inadaira, Musashimurayama-shi, Tokyo, 208-0023 Japan
TEL:＋81(42)560-8611 FAX:＋81(42)560-8550
Factory
Sayama Factory
Production Headquarters，Sales Department，Quality Assurance Department, Technical Development Center
108, Sayamagahara, Iruma-shi, Saitama, 358-0032 Japan MAP
TEL: ＋81(4)2934-6116 FAX:＋81(4)2934-4640
Saga Factory
2100-34, Tsutsumi, Kamimine-cho, Miyaki-gun, Saga, 849-0124 Japan MAP
TEL:＋81(952)-53-1215 FAX:＋81(952)-53-1210
Saga Second Factory
2100-16, Tsutsumi, Kamimine-cho, Miyaki-gun, Saga, 849-0124 Japan
TEL:＋81(952)-20-2710 FAX:＋81(952)-20-2818
Corporate History
| Aug 1951 | Established Gold and Silver Plating Laboratory in Mitaka-shi,Tokyo. |
| Oct 1952 | Moved the laboratory to Kodaira-cho (Kodaira-shi at present) |
| Nov 1956 | Reorganized the laboratory into limited private company Nishihara Surface Process Factory, and started the mass production of transistor and other semiconductor parts. |
| Mar 1960 | Reorganized it into stock company, and set up the Kodaira factory and expanded the facility. |
| Apr 1965 | Invented the SAB plating (bright solder electroplating) and developed the new fields in semiconductor, electronic part and plating on printed-wiring board. |
| Mar 1969 | Changed the company name to Nishihara Rikoh Corp. and established Sayama Factory in Iruma-shi, Saitama. Accomplished the automated mass production for semiconductors and electronic parts. |
| Jun 1984 | Newly established the Saga Factory and started the mass production for IC Lead Frame. |
| May 1985 | Established the high precision stripe plating technology（STP） for hoop material. |
| Mar 1996 | Developed the new pre-solder Tin plating for environmental measure against lead pollution. |
| Oct 1997 | Acquired ISO9002 for Head Office and Sayama Factory. |
| Sep 1998 | Started the mass production for lead-free plating. |
| Nov 2002 | Whole company achieved ISO9001. |
| Nov 2003 | Obtained the patent (No.3492554) for Tin-Bismuth alternative to lead. |
| Dec 2003 | Whole company achieved ISO14001. |
| Sep 2006 | Started the mass production of partial gold plating for connector. |
| Nov 2006 | Increased the capital to JPY 76,2 mil. |
| Jul 2008 | Chosen for “Active 300 small and medium enterprises” by METI (Ministry of Economy, Trade and Industry). |
| Jul 2009 | Certified “Development and industrialization of Partial Plating with high precision masking” by METI-Kanto as the plan of new business field for coalition of different field. |
| Jul 2012 | Received TPM Challenge Award from Japan Institute of Plant Maintenance |
| Nov 2014 | Received "Environmentally-conscious Monodzukuri Award" from Greater Tokyo Initiative |
| Feb 2015 | Received Tama Shinkin Bank "Tama Blue Award" Excellence Award and METI-Kanto Award |
| Jul 2016 | Measures against whisker of connectors obtained a patent on Ag-Sn-Bi plating (Japanese Patent No. 5964478) |
| Oct 2017 | Received TPM Excellence Award Category B from Japan Institute of Plant Maintenance |
| Sep 2018 | Saga factory new building location agreement signing ceremony was held. |
Related Links
N-Sn enables secure soldering and improves performance of electronic components.
Our mass production technology and quality assurance process enable hoop plating on aluminum materials.
We provide hoop plating with stable quality at an inexpensive price.